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The name “Flip-chip” describes the method used to connect a semiconductor die to a substrate, which contrasts with conventional wire-bonding and ball-grid-array packaging.

In a Flip-chip package the dies are bumped and then “flipped” onto a substrate, hence the name “Flip-chip”, while conventional chip is composed of P-GaN, an active layer, N-GaN and Sapphire substrate from top to bottom.

The name “Flip-chip” describes the method used to connect a semiconductor die to a substrate, which contrasts with conventional wire-bonding and ball-grid-array packaging.

In a Flip-chip package the dies are bumped and then “flipped” onto a substrate, hence the name “Flip-chip”, while conventional chip is composed of P-GaN, an active layer, N-GaN and Sapphire substrate from top to bottom.

The name “Flip-chip” describes the method used to connect a semiconductor die to a substrate, which contrasts with conventional wire-bonding and ball-grid-array packaging.

In a Flip-chip package the dies are bumped and then “flipped” onto a substrate, hence the name “Flip-chip”, while conventional chip is composed of P-GaN, an active layer, N-GaN and Sapphire substrate from top to bottom.

The name “Flip-chip” describes the method used to connect a semiconductor die to a substrate, which contrasts with conventional wire-bonding and ball-grid-array packaging.

In a Flip-chip package the dies are bumped and then “flipped” onto a substrate, hence the name “Flip-chip”, while conventional chip is composed of P-GaN, an active layer, N-GaN and Sapphire substrate from top to bottom.